私たちの場所
浙江省、中国
Fused Silica Collecting Balls Products Furnace Parts for Melting Glass
Fused silica ceramic bodies have a shrinkage rate of less than 1%, making it easy to produce products with accurate dimensions. This makes it a heat-resistant ceramic material with promising development and utilization potential.
The main raw material used for quartz ceramic products is fused quartz fragments, with the following chemical composition: SiO₂ 98.25%, Al₂O₃ 0.15%, Fe₂O₃ 0.13%, free carbon 0.21%, and loss on ignition 0.17%.
The additives used are industrial minerals or chemical reagents. Fused silica ceramics have advantages such as low thermal conductivity, a small expansion coefficient, high-temperature resistance, good thermal stability, and corrosion resistance. They have been successfully applied in metallurgy, construction materials, chemicals, national defense, and scientific research sectors.
るつぼの機能
Fused silica ceramics, also known as fused silica ceramics, silica glass ceramics, silica glass sintered products, and fused quartz sintered products, are sintered bodies of amorphous silicon dioxide made using special processing techniques.
They have excellent thermal shock resistance, low thermal conductivity, a small expansion coefficient, high-temperature resistance, and good thermal stability, especially in glass kilns and glass products. silica ceramic products offer advantages such as corrosion resistance, erosion resistance, no contamination to glass products, and a long service life.
Currently, popular silica ceramic products include uniform material cylinders, picking balls, material basins, material bowls, stirring rods, punches, and gate bricks.
化学的および物理的指標
| アイテム | 単位 | エンタープライズ標準 | 方向 |
|---|---|---|---|
| Si02 | % | ≥99.5-99.8 | |
| Volume density | g/cm³ | ≥1.85-2.0 | |
| Apparent porosity | % | ≤5-15 | |
| Cold crushing strength | Mpa | ≥50-120 | |
| Cold flexural strength | Mpa | ≥25 | |
| High-temperature flexural strength | Mpa | ≥28 | |
| Coefficient of thermal expansion | x10-6K-1 | <0.6 | |
| Thermal conductivity | w/m.℃ | 0.66 | |
| 動作温度 | ℃ | ≤1650 |
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